Design, and Validation of a Thermal Interface System for the NVIDIA Jetson Orin Nano in a CubeSat Payload Application

Institute

Lehrstuhl für Spacecraft Systems (TUM-ED)

Type

Bachelor's Thesis /

Content

experimental / constructive /  

Description

This engineering project focuses on the design, support in manufacturing, and experimental validation of a mechanical and thermal interface system for the integration of a heat dissipation solution with the NVIDIA Jetson Orin Nano, intended for use as a payload component in the EventSat mission.
High-performance embedded computing platforms such as the Jetson Orin Nano are increasingly utilized in small satellite missions to enable onboard data processing, artificial intelligence applications, and autonomous decision-making. However, their integration into space environments introduces significant challenges related to thermal management and structural integrity, particularly under vacuum conditions and mechanical loads experienced during launch.
The objective of this project is to develop a reliable attachment mechanism between the existing heat dissipation system and the computing module, ensuring both efficient thermal transfer and mechanical robustness. The project encompasses the full engineering cycle, including computer-aided design (CAD), documentation for external manufacturing of the interface components, and experimental validation through vibration testing and thermal performance evaluation in a controlled vacuum environment.
The developed system will be assessed for its ability to maintain structural integrity under launch-like dynamic loads and to ensure adequate thermal dissipation in low-pressure conditions representative of space. The results will contribute to validating the suitability of the integrated payload for deployment in small satellite missions.

Possible start

sofort

Contact

Vincenzo Messina
Phone: +49 89 289 55752
vincenzo.messinatum.de

Announcement